Chip Packaging

A semiconductor die is normally assembled into a package. A custom device or Re-manufactured part can be assembled in a package of the customers choice (depending on die size and package availability). An off the shelf component can also be assembled in an alternative package to the original manufacturers offering. Custom packages can also be created, however this will require a Non Recurring Engineering charge (NRE).

There are several steps to the assembly process:-

· Die Attach - Here the die is mounted inside the package or ‘header’ using one of several adhesive methods e.g. Eutectic

· Bonding - Thin wires are effectively welded between each of the bond pads of the die to a finger on the metal leadframe. Normally gold or aluminium wires are used.

· Lid Seal - Here the lid is attached to the header so that the package becomes hermetically sealed. Plastic packages however are moulded (see below). Low to medium quantities are often hand assembled. High volumes are totally automated.

· Marking - Information is printed on the package to identify the device type, date of manufacture and the manufacturer. Also, traceability information in the form of a LOT number.

Due to the moulding process, plastic packages require specific tooling and setting up. As a result the minimum assembly quantity would be around 10Ku.

Plastic Packages