Service List

Chip Design

Not all engineering problems can be solved by off the shelf solutions. Depending on the technical requirements and volumes involved, it may be beneficial to create a custom part.

A digital design can be implemented either in an FPGA or an ASIC, normally volume and time dependant. Totally Analogue or Mixed Signal circuits need to be implemented in a custom chip.

We work with our Design House partners to provide you with the technical capability to realise your designs or part thereof. From designing individual modules, implementing off the shelf IP blocks & cores or creating a chip from original specifications, we have the right resources available. An FPGA to ASIC design conversion service is also available.

Silicon Foundry

The next phase in custom chip manufacturing is the production of a wafer (normally but not exclusively silicon). Our partners work from the industry standard GDSII format tape from the design house  to produce low volume wafer runs (Multi Project Wafer) for prototyping or high volume manufacturing runs.

Die & Wafer Handling

Not all chips are required to be put into packages and there is a growing need to use bare die. Wafers need to be inspected, sawn and probed and the die off loaded. More and more customers require the die to be solder bumped for flip chip assemblies.

Also die is required for hybrid assemblies, chip on board solutions etc. Our partners offer a range of services in this area including long term die storage.

Chip Packaging

Usually bare die need to be packaged to facilitate easier handling and assembly using standard automated equipment. A range of services including low volume ceramic / hermetic packaging, low to medium and high volume plastic packaging is available. Custom IC packages can also be arranged.

Component Testing

All normal components needs to be tested after assembly, this is to ensure no failures during the manufacturing process. In addition standard components may need to be re-tested for various reasons such as; validating parts from the grey market, up-screening parts to a higher temperature/speed rating, screening parts for a specific parameter.

A wide range of services can be supplied depending on your requirements.

Hybrid Circuit Design & Assembly

A hybrid circuit typically uses a combination of packaged and unpackaged components. Thereby utilising the space saving qualities of bare die with the ready availability of off the shelf components. Substrates can be either standard FR4 for low value circuits or ceramic for high reliability applications. Thick film hybrids are typically used in low cost applications such as automotive whereas thin film is used in higher density devices. Multi chip modules (MCM’s) can be created for high density projects or simple chip-on-board (wire bonded die) can be used where cost is paramount.

Component Sourcing

Often solving a manufacturing problem is as easy as locating the right parts for the job. We offer a component locating service which when coupled with our testing & up-screening services, offers a guaranteed route to success. Custom designs or re-manufacturing may not always be the right answer and sometimes who you know not what you know helps to resolve the problems in the most cost effective way.

Printed Circuit Board Assembly

Using the latest surface mount technology (SMT) enables state of the art component packages such as uBGA and ‘0201’ components to be assembled with ease. Our partners offer low to medium volume runs with a long history and experience in some of the most demanding application segments such as automotive, military and telecommunications.